» Three element gas flow sensor integrated with low temperature cofired ceramic module
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DOMINIK JURKÓW  KAROL MALECHA LESZEK GOLONKA
The LTCC (Low Temperature Cofired Ceramics) has been developed
for last three decades. At the beginning the technique
was mainly used to manufacture ceramic MCM-C (Multi Chip
Modules) [1]. However, LTCC has good both electrical and
mechanical properties, because of it the technology was applied
in sensors and microsystems applications. Recently Low
Temperature Cofired Ceramics are used to fabricate various
devices e. g. microwave band-pass filter, miniaturized strip antenna
[2], chemical sensor, cantilever structures [3]. In addition
LTCC enables fabrication of various fluidic devices such
as chambers, [4,5], fluid mixers [6], biosensors [7], enzymatic
microreactors [8] and microflow analyzers [9].
The first LTCC thermal-based flow sensor was presented
in [10]. The device cons[...]
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ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA 2009/12
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» LTCC microfluidic chip with fluorescence based detection
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Mateusz Czok Karol Malecha Leszek Golonka
Nowadays miniaturization is present in many fields of science (electronics,
medicine, biology and chemistry). Over the last few years
many research into miniaturization and microfabrication were carried
out. As a result the concepts of the micro-total analysis system (μTAS)
and Lab-on-Chip (LoC) were proposed. These devices integrate several
laboratory functionalities in a single miniature structure [1, 2].
There are few technologies that can be applied in the realization of
the LoC devices. For many years the most common used materials
were silicon and glass wafers [3, 4]. As an alternative solution few
other materials like PDMS (poly(dimethylsiloxane)) or PCB (Printed
Circuit Boards) were used for microsystems fabrication [5, 6].
The Low Temperature Co-fired Ceramics (LTCC) seems to be
a suitable material to realize LoC devices. Channels, chambers,
valves, electronic and optoelectronic components can be easily
integrated in one LTCC module [7, 8]. It also has outstanding physical
and chemical properties [9].
The main motivation is to use the LTCC technology in the fabrication
of the microfluidic chip, in which fluorescence detection of
biological sample can be performed. The manufactured detection
module consists of inexpensive and commonly available electronic
components and PMMA (poly(methyl methacrylate)) optic
fibres integrated with the LTCC microfluidic chip. It is made up of
the microfluidic channel, cavities for fiber optics, miniature light
emitting diode and photodetector.
The LTCC microfluidic chip performance is investigated with
several different concentrations of fluorescein solutions which
are excited with 465 n[...]
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ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA 2012/1
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» Mikroprocesorowy sterownik temperatury do mikroreaktora chemicznego wykonanego techniką LTCC
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DOMINIK JURKÓW KAROL MALECHA PAWEŁ DURCZYŃSKI LESZEK J. GOLONKA
Dzięki bardzo szybkiemu rozwojowi technologii mikroelektronicznych,
aktualnie wiele analiz (bio)chemicznych wykonuje
się w mikroukładach przepływowych. W początkowym etapie
rozwoju mikrosystemów analitycznych (µTAS - Micro-Total
Analysis System) do ich konstrukcji stosowano głównie
krzem, szkło [1,2] oraz różne materiały polimerowe (np. poliwęglany,
poliimidy). Aktualnie coraz częściej do wykonywania
tych układów wykorzystywane są inne materiały, np. niskotemperaturowa
ceramika współwypalana LTCC (Low Temperature
Co-fired Ceramics) [3,4]. Technologia bazująca na tej
ceramice pozwala na bardzo łatwą integrację elementów fluidycznych
(np. kanały, komory) oraz elektronicznych (np. grzejniki,
termistory) we wnętrzu jednego modułu ceramicznego
LTCC.
W artykule przedstawiono [...]
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ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA 2009/3
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» Laser patterning of coloured green ceramic tapes
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KAROL MALECHA DOMINIK JURKÓW JOHANNA STIERNSTEDT LESZEK GOLONKA
HTCC (High Temperature Cofired Ceramics) and LTCC (Low
Temperature Cofired Ceramics) technologies have been developed
for many years. Both techniques enable fabrication of
MCM-C (Ceramic Multi Chip Modules) devices [1]. Moreover,
various sensors, actuators and microsystems can be utilized with
these technologies [2-5]. Design flow of both methods consists
of: tape preparation, vias and shapes forming, conductive tracks
and passive elements deposition, stacking, lamination, cofiring
and post processing [6]. A traditional LTCC structure consists of
several (or more) dielectric tapes, connecting vias, surface and
buried conducting lines and passive components (resistors, capacitors,
inductors). The conductors and passive components
are deposited on ceramic tape using standard screen-printing
or ink-jet printing method. After deposition process all green ceramic
tapes are stacked together in proper order and burnlaminated
using an isostatic or uniaxial press with a pressure
of 5-30 MPa at temperature 40-90oC for time up to 30 minutes.
Then the ceramic module is cofired in air in special thermal profile
with a maximum temperature of 850oC (for LTCC) or 1600oC
(for HTCC). Afterwards active and passive components can be
added on the ceramic module’s surface using standard SMT
(Surface Mounting Technology) or flip-chip techniques.
Three main techniques of vias and three-dimensional structuring
of green ceramic tape are recently utilised: laser pattering
[7,8], hot embossing [9] and mechanical punching [10]. The laser
cutting is the most flexible method. It is used in low mass production
and in fast prototyping processes. However, the cutting
quality depends strongly on laser light absorption by the green
ceramic tape. Absorption depends on laser frequency, tape composition
and colour. Moreover, laser power and beam velocity affect
the cutting[...]
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ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA 2011/3
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