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Wyniki 1-1 spośród 1 dla zapytania: authorDesc:"JOHANNA STIERNSTEDT"

» Laser patterning of coloured green ceramic tapes

KAROL MALECHA

DOMINIK JURKÓW

JOHANNA STIERNSTEDT

LESZEK GOLONKA

HTCC (High Temperature Cofired Ceramics) and LTCC (Low Temperature Cofired Ceramics) technologies have been developed for many years. Both techniques enable fabrication of MCM-C (Ceramic Multi Chip Modules) devices [1]. Moreover, various sensors, actuators and microsystems can be utilized with these technologies [2-5]. Design flow of both methods consists of: tape preparation, vias and shapes forming, conductive tracks and passive elements deposition, stacking, lamination, cofiring and post processing [6]. A traditional LTCC structure consists of several (or more) dielectric tapes, connecting vias, surface and buried conducting lines and passive components (resistors, capacitors, inductors). The conductors and passive components are deposited on ceramic tape using standard screen-printing or ink-jet printing method. After deposition process all green ceramic tapes are stacked together in proper order and burnlaminated using an isostatic or uniaxial press with a pressure of 5-30 MPa at temperature 40-90oC for time up to 30 minutes. Then the ceramic module is cofired in air in special thermal profile with a maximum temperature of 850oC (for LTCC) or 1600oC (for HTCC). Afterwards active and passive components can be added on the ceramic module’s surface using standard SMT (Surface Mounting Technology) or flip-chip techniques. Three main techniques of vias and three-dimensional structuring of green ceramic tape are recently utilised: laser pattering [7,8], hot embossing [9] and mechanical punching [10]. The laser cutting is the most flexible method. It is used in low mass production and in fast prototyping processes. However, the cutting quality depends strongly on laser light absorption by the green ceramic tape. Absorption depends on laser frequency, tape composition and colour. Moreover, laser power and beam velocity affect the cutting[...] więcej»
w zeszycie ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA 2011/3

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