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Wyniki 1-1 spośród 1 dla zapytania: authorDesc:"KRZYSZTOF MAŁECKI"

» A novel experimental setup for accelerated reliability assesment of solder and adhesive joints

KRZYSZTOF MAŁECKI

KRZYSZTOF URBAŃSKI

ARTUR WYMYSŁOWSKI

A continuously growing demands for customer electronics focus on miniaturisa-tion, higher reliability and faster product commercialisation. They are fulfilled primarily through an investigation and development of new methods for assembling, packaging, and dies integration. In reality, advanced technological apparatus and materials science play here predominant role. In parallel, the strong expansion on nanotechnology introduces new polymer materials and fillers, such as nanosilver (nanoAg) or carbon nanotubes (CNT), with combination of wide spectra front-end and back-end processing, opens completely new window for application performance and usability. However, these new opportunities force an extreme challenges on whole scientist and technology communities. Although, there are several advanced techniques for materials base parameters investigation, the final assessment of materials quality and ultimate product usability can be performed by means of reliability tests, which are the most accurate way to predict time to failure of any devices and electronic components. A spectra of tests potential of developed failure and reliability investigation system (FRIS) is reported in this paper. It base on a self-developed electronic control and data acquisition system, operated with innovative setup (allowing simultaneous load of different stresses and on-line monitoring the response of subjected sample). This approach allows in depth investigation of solder and adhesive joints reliability for electronic applications. Solder and adhesive joints -reliabilllity consideration Soldering is a well-established process that has been utilized and optimized for decades. In natural consequence, soldered joints are widely used in electronic packaging to form[...] więcej»
w zeszycie ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA 2011/3

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