Wyniki 1-4 spośród 4 dla zapytania: authorDesc:"Gilbert De MEY"

NMOS current mirror thermal analysis

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A current mirror is a circuit that sources (or sinks) a current. The ideal output resistance of a current source is infinite. Achieving high output resistance results in the output current not varying much with the voltage change across the current source [1]. The basic NMOS current mirror (Fig. 1) is made using two transistors. Let’s assume that both of them have the same width and length and note that VGS1 = VDS1 = VGS2. Because the MOSFETs have the same gate-source voltages, we expect (neglecting channel-length modulation) them to have the same drain current. Let’s say that the drains of both transistors are at the same potential. By matching the size, VGS and ID of two transistors, we are assured that the two MOSFETs have the same drain-source voltage, (VGS1 = V[...]

Gate level thermal simulation of CMOS ICs with emphasis on switching power

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CMOS technology of ICs is the most dominant nowadays. The constant tendency to make circuits smaller and faster to reach better performance results in higher power density and higher operating temperature. The latter degrades IC performance and impacts reliability. Nowadays, more than 50% of chip failures is caused by overheating a circuit’s structure [1]. For those high-power ICs thermal investigations must be done. For further description of the simulation method it is necessary to define power dissipation in CMOS circuits and common sources of power consumption. Power consumption and heat generation in CMOS technology Every CMOS digital circuit dissipates power whether its logic state changes or remains unchanged. Its power consumption can be expressed as a sum of fo[...]

Influence of ambient temperature on the amount of electric energy produced by solar modules

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The Sun delivers a great amount of energy to the Earth surface, therefore the production of electricity directly from solar radiation, with photovoltaic devices, has the potential to be one of the solutions to the world rising power consumption. Moreover, the photovoltaic conversion is environmentally friendly way of energy production and it helps to decrease the amount of carbon dioxide and other harmful substances emitted to the atmosphere and responsible for the greenhouse effect. A typical photovoltaic module is built as array of multiple interconnected photovoltaic cells, which converts solar into electric energy. Photovoltaic modules are widely used in many types of applications, ranging from small electronic devices, medium-size installations used to power spacecrafts or[...]

Pulse thermography measurements of heat dissipation from high power LED

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Authors focused on the research of heat dissipation problem in electronic devices. For this purpose, a series of thermovision measurements were carried out, and the object of the research was a high-power LED attached to a radiator. The thermal response in frequency domain was calculated. Gained data consisting of amplitude and phase values of the thermal response of the diode-radiator set-up during work allowed authors to estimate its cooling conditions, with particular interest set to the quality of thermal connection between the diode and radiator. Streszczenie. Autorzy podjęli problem zbadania zjawiska rozpraszania ciepła w urządzeniach elektronicznych. Jako obiekt badań wybrano wysokiej mocy diodę LED przymocowaną do radiatora i przeprowadzono szereg badań termowizyjnych. Wyznaczono odpowiedź termiczną w dziedzinie częstotliwości. Otrzymane amplituda i faza odpowiedzi termicznej pozwoliły na wyznaczenie warunków chłodzenia badanego układu. (Badania skuteczności chłodzenia diody LED wysokiej mocy metodą termografii impulsowej) Keywords: thermal resistance, convection cooling, thermal response, thermovision measurements. Słowa kluczowe: rezystancja termiczna, chłodzenie konwekcyjne, odpowiedź termiczna, badania termowizyjne. Introduction This work is related to thermal issues in electronic devices, in particular thermal processes associated to connection between devices and radiators are taken into consideration. This topic is of great importance, because the power density increases significantly in newer, mostly microelectronic devices when new technologies are put to production. Ubiquitous miniaturization demands from producers to use more and more efficient heat dissipation systems from those devices. What is more, increasing complexity of electronic devices and the amount of data processed by it results in higher power consumption and heat emission. Hence it is necessary to provide efficient ways of cooling electronic devices.[...]

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